Features:
1.High quality heating material produces high temperature breezing, precise controlling BGA soldering and unsoldering.
2.Movable heating head can be moved to all directions for easy operation.
3.Upper/lower hot air set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation.
4.Upper hot air 8 segments temperature up (down) + 8 segments constant temperature control with 10 groups temperature setting savable. Lower hot air 8 segments temperature up (down) + 8 segments constant temperature control with 10 groups temperature setting savable and communication with the computer.
5.BGA soldering zone supporting frame can be fine adjusted the height to prevents the depression of soldering area.
6.Fixed frame that multi-function PCB can be convenience to fix up quickly and fix to abnormity PCB.
7.Powerful cross flow fan cools down lower heating zone instantly.
8.Beep alarming function when soldering or unsoldering finished. Hand vacuum pen pick away BGA easily.
9.Equipped with over temperature alarming and protection function for both upper and lower heating zone.
10.Equipped with a couple of different sizes Alloy nozzles that are easy to be replaced and can be customized based on practical needs.
11.Laser positioning setup makes fixing PCB more quickly and conveniently.
12.Solid status working can be displayed that secures safe temperature controlling.